Technical Papers

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• Plasma Dicing >
• Etching >
• Deposition >
• MEMS >

Plasma Dicing

• Plasma-based die singulation processing technology
• Wafer Dicing Using Dry Etching on Standard Tapes and Frames
• Plasma Dicing for MEMS - No More Chipping!
• Plasma-Dicing Methods for Thin Wafers - Chip Scale Review
  

Etching

• Characterization of GaAs/A1GaAs non-selective ICP etch process for VCSELs applications
• The Effects of Increasing the Aspect Ratio of GaAs Backside Vias
• Eliminating Pillars During GaAs Via Etch Formation
• Characterization of a 10um/minute Chlorine-Based ICP Etch Process for GaAs vias
• Advances in Deep Silicon Etching
• Advances in GaN Dry Etching Process Capabilities
• Process and Equipment Challenges for MEMS Deep Silicon Etching
• Photomask Cr Process- 65nm Plasma Etch has Arrived
• Photomask SBU- 65nm Dry Etch has Arrived
• 905 nm wavelength laser as a new source for in-situ end point detection of dry etching
• Advanced Selective Dry Etching of GaAs_AlGaAs in High Density Inductively Coupled Plasmas
• Recent Development of Advanced InP Etching
• Extremely High Selectivity Etching of GaAs_AlGaAs in Inductively Coupled Plasmas
• Selective RIE in BCl3_SF6 Plasma for GaAs HEMT Gate Recess Etching
• Reduction of Device Damage During Dry Etching of Advanced MMIC Devices Using Optical Emission Spectroscopy
• Improving Etch Rates in Deep Silicon Etching
• Significant enhancement of selectivity and anisotropy for high rate plasma etching of GaAs over AlGaAs for heterojunction bipolar transistor structure
• A New Production Solution for High Selective and Low-Damage Etching of GaAs-Based Devices
• Recent Improvements in Deep Silicon Etching
• Deep Silicon Etch Profile Control
• Reliable Deep Silicon Etching for High Volume Production Applications
• Characterization of GaAs-AlGaAs non-selective ICP etch process for VCSELs applications
• Quartz etch process to improve etch depth linearity and uniformity using Mask Etcher IV
• Aspect ratio dependent etching lag reduction in deep silicon etch processes
• Endpoint Detection Methods for Time Division Multiplex Etch Processes
• Assessing Deep Reactive Ion Etch (DRIE) at CNF

Deposition

• Notch Reduction in Silicon on Insulator
• The Advantages of Integrated Passives
• Plasma Processing for MMIC Device Manufacture
• Challenges and Breakthroughs in Plasma Processing for Advanced Electronic Devices
• Development of Low Temperature Silicon Nitride and Silicon Dioxide Films by Inductively Coupled Plasma Chemical Vapor Deposition
• Inductively Coupled Plasma Deposition of Low Temperature Silicon Dioxide and Silicon Nitride Films for III-V Applications
• Advanced Thin Film Processing for MMIC Manufacture
• Production Performance Success with a High Throughput PECVD System
• Stress Control of Si-based PECVD Dielectrics
• An Integrated Deep Silicon Etch-Directional Physical Vapor Deposition Process for Through Wafer Applications
• Batch Deposition Module Cuts Downtime and Material Waste
• Optimization of Low Stress PECVD Silicon Nitride

MEMS

• Advanced Processing Capabilities for MEMS Device Fabrication
• Current Trends with DRIE/DSE- Processing for MEMS Devices and Structures
• Silicon Nitride for MEMS applications: LPCVD and PECVD Process Comparison