Advanced Vacuum’s SLR Series provides etching capabilities over a variety of materials and substrates. The small footprint, low cost, ease of use and superior performance
make the SLR Series ideal for a wide range of uniform, high quality ICP etch applications serving R&D, FA, prototyping, pilot line and low volume production. The SLR Series is ideal for numerous technologies such as Failure/Yield Analysis, Photonics, Solid State Lighting, MEMs, and Wireless ICP etch processing.
The SLR Series is a continuation of Plasma-Therm’s highly regarded Shuttlelock® system in a compact, robust and easily maintained form factor.
Advanced Vacuum, a Plasma-Therm company, is the manufacturer of the Vision 300 and 400 (formerly Plasma-Therm 790+) series open-load etch and deposition systems.
The SLR Series provides technology for etch using a high density ICP source with a RF biased lower electrode:
SLR ICP (Inductively Coupled Plasma)
The ICP system utilizes a load lock with manual loading
- Process Library: The SLR system uses well-established reactor technology that provides reliable performance and is supported with guidance from a continuously
evolving process library.
- Endpoint: Both laser and optical emission spectroscopy endpoint technologies are available on SLR to augment processing capability.
- Data Logging: Simplified data collection for sharing of process monitoring and recipe information.
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